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Low-power, Class-AB stereo driver for space-constrained applications



 

The TDA1308AUK from NXP is Class-AB stereo headphone driver housed in an 8-bump Wafer Level Chip Scale Package (WL-CSP) measuring only 0.61mm x 0.84mm x 0.38mm. The reduced footprint makes the driver ideal for use in space-constrained applications and portable products.


The TDA1308AUK offers a large output-signal swing and excellent noise performance, and delivers Class-AB stereo operation from a single (2.4V to 7.0V) or dual (1.5V to 3.5V) range. The device operates over a wide temperature range with no switch on/off clicks.

Manufactured in a 1µm CMOS process, the TDA1308AUK also offers high signal-to-noise ratio, high slew rate, and low distortion. It has a typical power dissipation of 15mW (no load), 90dB power-supply ripple rejection at 100Hz, and has built-in circuitry that protects against short circuits.

 

FEATURES
  • Output power: 40mW (typ) or 80mW (max)
  • 3.0mA quiescent current (no load)
  • 90dB PSSR
  • 0.03% total harmonic distortion plus noise to signal ratio
  • 70dB channel separation
APPLICATIONS
  • Headphones
  • LCD TV
  • Hearing aids
  • Monitors
  • Portable radios
  • Portable products

 


 

 www.standardics.nxp.com/products/audio.amplifiers/

 

 

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