Power package technology extends portable performance
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New p-channel power MOSFETs from Vishay feature PowerPAK® ChipFET® package technology which delivers advanced thermal performance in a compact 3mm x 1.8mm footprint. |
The Si5xxDU series comprises seven MOSFET
variants, achieving 75% lower thermal resistance
values, a 33% smaller footprint area, and a 23%
lower package height of 0.8mm compared to
alternative devices in the conventional TSOP-6
package.
Also benefiting from 35% lower on-resistance,
the Si5xxDU series enables longer battery runtimes
in portable devices, and will replace TSOP-6
MOSFETs in load, charger, and battery-switching
duties.
The maximum power dissipation of 3W is
comparable with the larger SO-8 package,
allowing designers to migrate directly to PowerPAK
technology to reduce size, improve performance,
increase reliability and simplify assembly.
FEATURES
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- Pin-compatible with ChipFET package
- Available configurations:
- Single-MOSFET
- Dual-MOSFET
- Complementary co-packaged MOSFETs with or without Schottky diode
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APPLICATIONS
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- Power-switching in portable products
- Asynchronous DC/DC converters
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Package innovations minimise thermal and electrical resistance
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