C&K rebranded

Software streamlines development of high-power LED systems

ITT Industries Switch Division has been acquired by a private equity firm Littlejohn LLC, USA. The new division, manufacturing electro-mechanical switches and previously known as C&K and T&S, has been re-branded under one single name: C&K Components.

This new status makes C&K Components the largest independent switch manufacturer with the broadest product portfolio offering; rocker and toggle switches, snap switches, detection switches, push- buttons, tact switches, illuminated key-switches, smart card connectors, and custom switch development capability.

Future Electronics will continue to offer high-volume off-the-shelf availability of C&K Components' products.

 

Bus bridge built for PCI Express to PCI/X

Tundra Semiconductor has developed the Tsi384, a high-performance bus bridge that connects the PCI Express (PCIe) protocol to the PCI and PCI-X bus standards. The Tsi384 supports 1, 2, or 4 lanes, enabling the bridge to offer throughput performance of up to 1GBps.

The device's PCI/X interface can operate up to 133MHz in PCI-X mode, or up to 66MHz in PCI mode. This interface offers designers extensive flexibility by supporting three types of addressing modes: transparent, opaque, and non-transparent.

The Tsi384 incorporates many advanced PCIe protocols that increase systemperformance, including: lane reversal and polarity inversion, end-to- end CRC, ASPM L0 link state power management, and hot plug. In addition tolow-latency operation, the device supports a maximum payload size of up to 512 bytes to allow better throughput efficiency.

 

ESD technology achieves reduced capacitance and clamping voltage

ON Semiconductor has released the ESD9L, a single-line ESD protection device that offers 0.5pF capacitance and industry-leading low clamping voltage. Available in the industry's smallest package for ESD protection, the ESD9L is designed for safeguarding high-speed data lines in portable applications.

Traditional off-chip protection solutions based on silicon TVS diodes offer low ESD clamping voltages and fast response times, but their high capacitance limits their use in high-speed applications. Competing off-chip protection technologies, such as polymer and ceramic-based varistors, offer low capacitance, but their high ESD clamping voltage limits their ability to protect the most sensitive ICs from ESD damage.