Power modules increase integration to save component count
Fairchild’s latest MotionSPM™ modules for
applications up to 3kW integrate
bootstrap diodes that display bootstrapresistor
characteristics, allowing system
designers to eliminate a further six
external components compared to
previous-generation modules.
The new modules implement three fullytested
HVICs, one LVIC, six NPT IGBTs, six fastrecovery
diodes and the three bootstrap
diodes into a 44mm x 26.8mm Mini-DIP
package. Packages for applications above
1.5kW are enhanced with Direct-Bonded
Copper (DBC) technology for enhanced
reliability and easier thermal management.
In total the modules can save up to 22
discrete components, thereby reducing
board space, manufacturing costs and timeto-
market while also enhancing system
reliability. The integrated IGBTs also achieve
an optimal combination of conduction
losses, switching losses and guaranteed
junction temperature to improve system
efficiency and longevity.
FEATURES
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- 150°C guaranteed junction temperature
- 2500V isolation voltage
- Long short-circuit withstand time
- Under-voltage, thermal-shutdown, and short-circuit protection
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APPLICATIONS
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- Home appliances
- Industrial motor drives
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