Flip-chip Schottky diodes improve circuit efficiency

The FlipKY® wafer-level, chip-scale format, utilised by Vishay FCSP flip-chip Schottky diodes, offers the anode and cathode on the same side of the die.

The anode and cathode connections are made through solder bump pads on one side of the silicon. This design not only minimises board space, but also reduces thermal resistance and inductance for improved overall circuit efficiency. The FCSP series includes 0.5A, 1.0A, and 1.5A flipchip Schottky diodes with footprints of 0.9mm x 1.2mm x 0.5mm (0.5A) and 1.5mm x 1.5mm x 0.6mm (1A and 1.5A). An advanced physical design allows FlipKY products to offer high-end efficiency within a footprint of 1/5th to 1/10th, compared to devices in standard packages with the same electrical specifications.

 

FEATURES Low forward voltage per footprint area Full operation at 150°C Choice of low forward voltage to optimise conduction losses, or low reverse leakage to optimise reverse power losses Supplied in tape-and-reel format for standard SMD techniques

APPLICATIONS Battery protection Freewheeling diodes Boost diodes Current steering

 

 

 

• Vishay’s OR-ing Power MOSFETs, page 080205
• ON Semiconductor’s NCP3102, page 080208
• Vishay Siliconix MOSFETs, page 080221

 

Vishay/FCSP series