Design faster using second-generation ZigBee technology
Freescale Semiconductor has launched
three reference designs to accelerate
projects using its second-generation
ZigBee™-compliant System in Package (SiP)
devices, including two modules featuring
I2C connectivity and a design
for a USB stick.
Each design targets the
MC1321x family of IEEE802.15.4-compliant ICs that combine the RF transceiver, 8-bit
MCU and a choice of Flash memory densities. The
1321x_ICB and 1321x_IPB modules emphasise
compactness by using two-layer PCB construction,
and include a chip antenna or printed F-type
antenna respectively. Both modules feature a built-in
UART, and the 1321x_IPB also includes an ADC.
The 1321x_UCB USB-stick reference design
follows a compact form factor using a
chip antenna, and connects to the
USB bus via a USB-to-UART
interface IC. The module
appears as a virtual COM
port when connected to
a personal computer
FEATURES
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- Support for Background Debug Mode (BDM)
- ZigBee design support includes:
- Protocol stacks
- ZigBee software tools
- Demonstration applications
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APPLICATIONS
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- Remote metering
- Sensor networking
- Distributed controls
- Remote monitoring
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Reference designs 1321x_ICB / IPB / UCB are available to members of the Future Board Club.
To apply for the development board, and membership of the Board Club, go to
www.my-boardclub.com/manf-offers.htm
This offer is free and subject to qualification. |
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