Chip-scale Schottky diodes enhance control and minimise losses

Vishay has employed wafer-level chip-scale packaging to create a range of Schottky diodes featuring anode and cathode connections on the same side of the die, which practically eliminate package parasitic effects for enhanced all-round performance.

The FCSP FlipKY® series includes diodes rated for 0.5A forward current within dimensions of 0.9mm x 1.2mm x 0.5mm, as well as 1.0A and 1.5A diodes measuring 1.5mm x 1.5mm x 0.6mm. These occupy, respectively, onetenth and one-fifth of the footprint of conventional devices in SMA packages, and bring additional benefits including extremely low thermal resistance for efficient power dissipation.

The anode and cathode connections are made via solder pads on the underside of the package, which simplifies board layout.

Members of the FlipKY family allow designers to optimise device selection for low forward voltage to reduce conduction losses or low reverse leakage to minimise reverse-power losses. The devices enable a compact and efficient solution for duties including battery protection, current steering, freewheeling and boost-diode operation in a wide range of end products.

 

APPLICATIONS Bluetooth accessories Portable data equipment Digital cameras Personal video players

 

 

 

Vishay FCSP FlipKY Schottky Diodes