Stacking connectors emphasise density and signal integrity

MICTOR surface-mount board-to-board stacking connectors from Tyco Electronics feature a micro-strip architecture comprising two rows of signal contacts divided by a central power-ground plane, to maximise both connection density and signal integrity.

MICTOR connectors are compatible with motherboard and daughter-card architectures, and include designs for cable-to-board applications as well as parallel board-to-board and flex-toboard connections. Various mated heights are available for parallel board-to-board systems.

Available sizes range from 38 signal positions to 266 positions, in increments of 38 positions. There is a discrete ground bus every 12.7mm of the connector length, which can be assigned to either power or ground in any combination. Redundant interfaces on every signal line provide added reliability. The connector system maintains 50Ω impedance and uses the central ground bus between the rows of signals to maintain low crosstalk and boost high-speed signal characteristics.

Several plating options are available to meet the needs of various applications. The housing material is a liquid crystal polymer, compatible with infrared and forced air convection soldering processes.

 

FEATURES 76 dedicated signal lines per inch 0.64mm contact spacing Built-in connector-to-board retention feature Easy un-mating International product approvals

APPLICATIONS Business and retail equipment Communication equipment Industrial machines Medical equipment Aerospace and defence systems

 

 

Tyco Electronics / MICTOR