Automotive MOSFETs deliver choice and performance

NXP Semiconductors has a range of power MOSFETs qualified for automotive applications, which allow designers to meet a variety of system priorities such as high current-handling capability, low losses, compact footprint or low mounted height.

For high-power systems such as Integrated Starter Alternators (ISAs), where currents can reach 100A, NXP has enhanced the bond-wire architecture and heatsinking guidelines for its BUK75 and BUK95 High-Performance Automotive (HPA) TrenchMOS® devices in SOT78 and SOT404 packages. Advantages include reducing the number of devices required to conduct a given current, thereby reducing the size and cost of each assembly, as well as allowing standard mounting techniques to further reduce assembly costs.

For lower-current applications, NXP offers the BUK7Y and BUK9Y families in the SOT669 Loss-Free Package (LFPAK). The LFPAK is optimised for low on-resistance and high thermal performance within compact dimensions. Target applications include those where space is at a premium, such as engine-management modules or motordriven positioning systems. The package thickness of 1.1mm is 40% less than the industry-benchmark SO-8 package. Also, by implementing multiple thermal paths to remove heat from the die, the LFPAK achieves low thermal resistance comparable to larger packages such as DPAK and D²PAK.

 

FEATURES BUK75 and BUK95: On-resistance range: 1.8mΩ to 6.0mΩ Voltage ratings: 30V to 75V Industry-standard package outlines BUK7Y and BUK9Y: On-resistance range: 7mΩ to 104mΩ Voltage ratings: 30V to 150V SO-8-compatible footprint

APPLICATIONS Automotive systems: Alternators, power steering, oil or water pumps Engine-management modules, motor drives, general-purpose switching Other motors, lamps and solenoids Non-automotive 12V systems

 

NXP Semiconductors / BUK75/BUK95 & BUK7Y/BUK9Y