Tri-core DSP System-on-Chip solves wireless design challenges

To eliminate ASIC-development overheads and FPGA power consumption from the challenges facing base station designers, the MSC8113 System-on-Chip (SoC) from Freescale Semiconductor combines three DSP cores with communication-specific peripherals and capabilities.

Targeting high-bandwidth and highly-computational DSP applications, the MSC8113 has been optimised for wireless transcoding and packet telephony as well as high-bandwidth base station applications. The device will allow customers to add next-generation features that efficiently use available frequencies and higher bit rates in 3G systems.

The highly-integrated SoC combines three StarCore SC140 extended cores with an RS-232 serial interface, four Time-Division Multiplexed (TDM) modules featuring direct interfaces to T1/E1 framers, a 6.25Mbit/s UART, 32 configurable 16-bit timers, a flexible System Interface Unit (SIU), an Ethernet interface, and a multi-channel DMA controller. The three extended cores deliver combined processing performance up to 4800DSP MMACS at 400MHz. Each core has four arithmetic logic units (ALUs), internal memory, a write buffer, and two interrupt controllers.

 

FEATURES 60x-compatible system bus Rich signal-multiplexing capabilities Easy interfacing to H.110 devices Flexible memory controller for accessing various external memories Low core and I/O operating voltages Operating temperature range: -40°C to 110°C

APPLICATIONS Highly-computational DSP Wireless transcoding Packet telephony High-bandwidth base station applications

 

 

 

• Diodes Incorporated’s ZXGD3101, page 080910
• International Rectifier’s MOSFETs, page 080916

 

Freescale Semiconductor / MSC8113