High-Density Backplane Connector Protected Against Handling Damage
The Z-PACK TinMan family enables a
high-density, high-performance
backplane interconnect system.
Tyco’s Z-PACK TinMan connector design
follows proven industry backplane
convention by offering a fully-protected
right-angle receptacle for use on daughtercards
where handling damage can be a
concern when mating to a vertical male
header. This connector permits field repairs
at either the module or single-pin levels.
Ground contacts positioned within each
column of the connector, combined with
contact lead-frame arrangements, enable the
Z-PACK TinMan connector to achieve low
crosstalk and high through-put performance.
Reliability is assured with a dual point-of-contact
mating interface and compliant pin
interface to the PCB.
Designed for cost-pressured, high signal-density
applications requiring
interconnection between two PCBs, the
product family includes
configurations to fit
20.32 [.800] and 25.40
[1.00] card slot spacing.
FEATURES
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- 12Gb/s performance
- 100Ω impedance for differential pair configuration
- Meets industry reliability requirements of Bellcore/Telcordia
- Sequencing for ground and signal contacts
- Modular system offered in various column modules
- Right-angle pin-headers (coplanar) in 3-pair, 4-pair and 5-pair modules
- Vertical receptacles (parallel board) in 4-pair modules
- 6x12 and 6x6 modules for mid-plane orthogonal applications
- Reliable, redundant contact design on every signal contact
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APPLICATIONS
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- Switches: stackable, carrier grade, core, edge and metro Ethernet
- Servers: blade, rack mount and mainframe
- Routers: edge, core, enterprise class, carrier Ethernet, BRAS, and multi-service edge
- Optical: carrier-grade optical, metroWDM, opticalmulti-service provisioning, long-haul optical and enterprise LAN optical Ethernet
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