Silicon and Package Enhancements Boost Power-MOSFET Performance
By achieving on-resistance as low as
1.7mΩ within the standard SO-8
footprint, NXP’s range of 30V Trench 6
logic-level MOSFETs enable high-power
density and efficiency in power
converters and power-ORing
systems.
Trench 6 technology also delivers low
gate-charge and low gate-resistance
making the devices suitable for
switching frequencies typically up to
1MHz. They are especially suited for use in
high-efficiency synchronous buck regulators.
The devices are delivered in a Loss-Free
Package (LFPAK) matching the widely-used 5mm
x 6mm outline but bringing extra benefits by
reducing package height to 1mm. In addition,
low thermal resistance and low package
inductance contribute to the high current
capability and switching frequency of the Trench
6 family. As a further benefit, the package is
compatible with visual inspection
techniques, unlike many other Power-SO8 devices.
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APPLICATIONS
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- Voltage regulators
- Motor control
- Power ORing
- Load switching
- Li-ion battery protection
- LED lighting controls
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Product launch packs are available.
To apply for your free pack,
please email info@my-ftm.com
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