NXP Semiconductors : New Cloud Connectivity Kit speeds time to market for new IoT devices – LPC43S67-A70CM Cloud Connectivity Kit

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NXP Semiconductors has launched the LPC43S67-A70CM Cloud Connectivity Kit, part number OM13086, which enables OEMs to dramatically reduce the time it takes to get IoT products to market.

The kit helps designers to convert unconnected embedded products to cloud-connected products without the need for deep expertise in security, Wi-Fi® stacks, device commissioning or cloud-service application programming interfaces.

The kit is based on the LPCXpresso43S67 board, which features the triple-core, 32-bit LPC43S67 microcontroller, together with the NXP A7001CM secure microcontroller and the LPC General Purpose Shield, which includes an LCD screen, user LEDs, an Ethernet port, and various sensors and control devices.

Wireless connectivity is enabled by a Murata SN8000 802.11b/g/n Wi-Fi module, and an NXP NTAG I2C NFC plug-in card.

The kit also provides for the software and device-commissioning functions required for cloud connectivity, since it is supported by the Zentri Secure Connected Product Platform. This provides the user with the ZentriOS, ZentriOS Software Development Kit (SDK), Zentri device management services, and the Zentri Mobile App SDK. The platform may be downloaded from the
Zentri portal, access to which is enabled by the Cloud Connectivity Kit.

FEATURES

  • Hi-Speed USB-based debug probe
  • Hi-Speed USB A/B connector for host or slave operation
  • 8 Mbit Macronix Quad SPI Flash memory
  • UART connector and built-in UART-to-USB bridge options
  • USB cables
  • Quick Start Guide and card insert with links to installation information.

APPLICATIONS

  • Vending machines
  • Personal health devices
  • Interactive displays
  • Factory automation equipment
  • Industrial gateways
  • Diagnostic equipment
  • Home appliances
  • Home thermostats

 
 

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Orderable Part Number: OM13086
 

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