Vishay Intertechnology has introduced a new series of three-phase bridge rectifier modules housed in a low-profile PressFit package.
Compared to devices incorporating solder-contact technology, the VS-xxMT160P-P modules dramatically lower manufacturers’ production costs while providing markedly better reliability. This is because the PressFit package offers greater resistance to shock and vibration than modules with soldered contacts, while eliminating problems such as cold spots, voids, splatter and cracks.
The PressFit package is also not subject to solder fatigue, a common failure mechanism in power modules operating at high temperatures.
The solderless PressFit technology allows for easy mounting to the PCB in a single step, greatly reducing assembly time, while simplifying maintenance in the field.
The VS-xxMT160P-P modules have a low 17mm profile, helping to save space in the end-product design and making the electrical layout easier in application-specific power supplies.
|Maximum DC output current (A)||45||75||100|
|Threshold voltage at 150°C junction temperature (V)||0.78||0.82||0.75|
|Maximum forward voltage drop at 25°C junction temperature, peak pulse current (V)||1.45||1.45||1.51|
- May be directly mounted on a heat-sink
- 3,500Vrms insulation voltage
- Low junction-to-case thermal resistance
- 1,600V maximum repetitive peak reverse voltage
- AC-DC input rectification
- Welding equipment
- Uninterruptible power supplies
- Switch-mode power supplies
- Motor drives