TE Connectivity – Board-level 3A interconnection system supports wire sizes up to 32 AWG

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TE Connectivity’s AMPMODU MTE interconnection system may be used for wire-to-board and wire-to-wire applications. Components available in the AMPMODU system include receptacle assemblies with guide ribs, vertical and right-angle polarised and latching headers, and single- and double-row coupling shrouds.

The product implements Insulation Displacement Contacts (IDC) or Crimp Snap-In contacts to suit the application’s needs. The benefits of IDC are time saving, the availability of pre-loaded contacts and support for automated assembly.

Crimp snap-in contacts are cost-effective, and provide flexibility by supporting a wider variety of wire sizes, but require manual labour in the assembly process. IDC and crimp snap- in contacts mate with the same header types.

Coupling shrouds permit ganging of smaller receptacle and pin assemblies with guide ribs to form larger single-
or double-row latching connectors. The AMPMODU MTE system supports both vertical and right- angle header types.

FEATURES

  • 3A current rating (single contact in free air)
  • 267V operating voltage
  • 22-30 AWG wire sizes for IDC configurations
  • 20-32 AWG wire sizes for crimp snap-in contacts
  • Operating-temperature range: -65°C to 105°C
  • High-temperature option is surface-mount compatible

APPLICATIONS

  • Medical instruments
  • Automotive controls
  • Copiers
  • Appliances
  • Commercial printing machines
  • Vending machines
  • Instrumentation and test equipment
  • Telecoms equipment
  • Storage equipment

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