TE Connectivity’s (TE) ChipConnect internal faceplate-to-processor cable assemblies are designed for the Intel® Omni-Path Architecture (OPA), a specification for cable connections that replace PCB traces to the faceplate in servers and other types of high-speed computing equipment.
TE’s ChipConnect cable assemblies mate directly with LGA 3647 sockets at the processor and with the Omni-Path Internal Faceplate Transition (IFT) connector at the faceplate, providing connections for signals transferred at speeds up to 25Gbits/s.
These cable assemblies reduce system design costs by eliminating the need to use costlier, lower-loss PCB materials to connect the processor to the I/O terminations. System design is made easier by reducing the complexity of PCB laminates and routing, as well as retimers.
TE is one of two Intel-qualified suppliers offering the first 100 series cable assemblies, and is also a development partner for future Intel designs.
In addition to these cable assemblies, TE offers the compatible LGA 3647 sockets and hardware required for Intel OPA-compliant assemblies.
- Available in range of standard lengths and break-outs and custom options
- 4x or 8x data-transmission lanes
- Spring latching provides secure connection
- 30 AWG TurboTwin 25Gbits/s-rated primary pair cable
- Networking equipment