Vishay – Rectifiers save space and improve thermal performance in consumer devices

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Vishay Intertechnology has introduced a new family of surface-mount Trench MOS Barrier Schottky (TMBS) rectifiers in a compact package, the eSMP® series SlimDPAK, or TO-252AE, package style.

The SlimDPAK rectifiers offer the advantages of a lower profile and better thermal performance than comparable devices in a DPAK (TO-252AA) package. While the new devices are footprint-compatible with the DPAK package, their profile is 43% lower, helping designers in the development of new ultra-slim consumer electronics products.

The TMBS rectifiers feature current ratings up to 35A for single-chip configurations, and 40A for dual-chip, centre-tap, common- cathode configurations. The rectifiers’ heat-sink area is 14% larger than that of devices in the DPAK package, providing for excellent thermal-resistance values of as little as 1.5°C/W.

The TMBS rectifiers are also notable for their low forward-voltage drop of as little as 0.44V at 20A, 0.46V at 35A, and 0.49V at 40A, helping to minimise losses in power-conversion circuits.

FEATURES

  • Maximum reverse voltages ranging from 45V to 150V
  • AEC-Q101 qualified version available
  • 175°C maximum junction temperature
  • Ideal for automated placement

APPLICATIONS

  • DC-DC converters
  • Freewheeling diodes
  • Polarity-protection diodes

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