Cypress – New MCU supports dynamic 3D graphics in instrument clusters

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CYPRESS_LOGO_2017_4C
Cypress Semiconductor has announced a new series in its Traveo™ automotive microcontroller family, providing more memory to support a hybrid instrument cluster with 3D graphics and up to six traditional gauges, as well as a head-up display. The highly integrated, single-chip devices in the S6J32xEK series include an advanced 3D and 2.5D graphics engine and provide scalability alongside Cypress’s lowpin-count HyperBus™ memory interface.