ON Semiconductor has introduced the new X-Class platform, a family of image sensors which allows a single camera design to support not only multiple product resolutions but also different pixel functionality.
The first devices in the new platform are the high-performance 12Mpixel XGS 12000 and the 4K Ultra-High Definition (UHD) XGS 8000 image sensors.
The X-Class image sensor platform enables a new dimension in camera design by supporting multiple CMOS pixel architectures in the same image sensor family. This allows a single camera design not only to support multiple product resolutions, but also various pixel features, such as larger pixels which trade resolution at a given optical format for higher sensitivity and low-noise operation to increase dynamic range.
By supporting these different pixel architectures through a common high-bandwidth, low-power interface, camera manufacturers can use existing inventory and accelerate the time-to-market for new camera designs.
The XGS 12000 and XGS 8000, are based on the first pixel architecture to be deployed in this platform: an advanced 3.2μm global-shutter CMOS pixel which features superior imaging performance, high image uniformity and low noise.
The XGS 12000 features a 4,096 x 3,072 pixel array in a one-inch optical format to supply the imaging detail and performance needed for modern machine-vision and inspection applications. XGS 12000 partswith a 10Gbit Ethernet interface operate at full resolution at speeds up to 90 frames/s. A USB 3.0 interface in other XGS 12000 parts supports a 27 frames/s output at full resolution.
The XGS 8000 has a 4,096 x 2,160 pixel array in a 1/1.1-inch optical format and is also provided in two speed grades: 130 and 75 frames/s, suitable for use in broadcast equipment.
- Common 163-pin LGA package with a 21mm x 20mm footprint
- Monochrome and colour options
- Compatible with 29mm x 29mm camera designs
- Machine vision
- Optical inspection systems
- Security cameras
- Intelligent transportation systems
- Broadcast equipment