FTM November 2017 EMEA Edition


Application Spotlight: Connectivity Featured Articles from: NXP – New reference design implements 15W Qi-compliant wireless charging transmitter Vishay – Generating isolated supplies for industrial applications using a synchronous buck regulator in an isolated buck topology Cypress – Integrated Bluetooth 4.2 module with MCU core supports stand-alone operation Future Electronics – How to successfully connect IoT […]

C&K – Robust switches offer long life in harsh operating conditions


C&K supplies a broad range of high- quality, durable switches for integration into various types of control gear in transportation equipment and off-road vehicles. The switches are ideal for use in control grips, joysticks, off-road panels, hydraulics, power-control panels, heavy equipment, lifts and other applications. Many of the C&K switches are suitable for harsh applications […]

CUI INC – Waterproof micro USB connector has IPx7 rating


CUI’s Interconnect Group has released the UJ2W-MIBH-4-SMT, a waterproof micro USB2.0 type-B jack connector which has an IP rating of IPx7, offering protection from liquid and moisture in challenging environments. Thanks to its copper-alloy contact terminals with 30μinch gold-over-nickel plating and stainless steel shielding, the UJ2W-MIBH-4- SMT offers high durability over a rated lifetime of […]

Cypress – Integrated Bluetooth 4.2 module with MCU core supports stand-alone operation


Cypress Semiconductor has introduced the CYBT-343026-01, a fully integrated Bluetooth® Smart Ready wireless module based on the Cypress CYW20706 Bluetooth radio IC. Conforming to the specifications of the Bluetooth 4.2 standard, the CYBT-343026-01 EZ-BTTM module is supplied with a royalty-free Bluetooth Low Energy stack. It features an ARM® Cortex®-M3 microcontroller core for stand-alone operation without […]

Cypress – IoT reference design board provides Wi-Fi and Bluetooth connections to the cloud


Future Electronics has developed the Nebula IoT cloud-ready board based on Cypress Semiconductor wireless communications technology. It enables system designers to quickly create IoT device prototypes and deploy IoT ecosystems. Wireless connectivity is provided by a Murata 1DX module, which features the Cypress CYW4343W, a chipset containing Wi-Fi®, Bluetooth® Low Energy and Bluetooth Classic radios. […]

Diodes Incorporated – Schottky diodes give performance gains of as much as 20%


Diodes Incorporated has used an advanced deep-trench fabrication process to produce a new SDT series of Schottky diodes which offers superior performance to planar-type Schottky diodes at similar or lower cost. At launch the family consists of 29 devices housed in thermally- efficient packages. The new Schottky diodes may be used to provide the blocking, […]

Future Electronics – How the latest connectivity technology can open up opportunities for new applications and new products


Connectivity and the Internet of Things are well supported today by manufacturers of RF components and modules, and of other types of connectivity components. This means that the task of embedding connectivity in end-product designs is readily enabled by the electronics supply chain. But if the problem of how to connect devices is more easily […]

Future Electronics – How to successfully connect IoT devices to the cloud: NB-IoT and LoRaWAN technologies compared


By Amar Abid-Ali Vertical Segment Manager Future Connectivity Solutions (a division of Future Electronics) For the past few years, Machine-to-Machine (M2M)and Internet of Things (IoT) applications have relied on 2G and 3G cellular telephone networks for wide-area connectivity. Consumer demand for high-speed broadband coverage on the smartphone has led network providers to supplement these older […]

Hirose – Robust wire-to-board connectors have small board footprint


Hirose has introduced the DF52 series of space-saving wire-to-board connectors for applications requiring high strength and durability. The connector range consists of crimp plugs and right-angle receptacles in a single row. The mated height profile is just 1.75mm, and the depth of the connector is 4.1mm, reducing the space on the board dedicated to connections. […]

Lattice – Latest IP cores for CrossLink FPGAs provide flexible video- bridging capabilities

Lattice Semiconductor has introduced seven new modular IP cores for its award-winning CrossLink FPGA product. These modular IP cores offer the building blocks for users to create their own unique video-bridging solutions. The cores are typically used to bridge between MIPI® and other traditional or legacy display and camera interfaces.