CUI INC – Innovative Peltier modules provide higher reliability and longer cycle life

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CUI’s line of high-performance thermoelectric cooling modules features an innovative arcTEC™ structure which delivers superior cooling performance and a longer cycle life. CUI’s high-performance Peltier modules are available in a wide range of sizes and current ratings to meet the needs of various applications. They range in footprint size from the smallest at 20mm x […]

C&K – New automotive detect switch’s safety features support ISO 26262 compliance

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C&K has announced the introduction of the SSW Detect Switch, which helps designers to enhance the functional safety of electronic systems. The SSW switch is intended for use in automotive applications, such as electric parking brakes, that must comply with the requirements of the ISO 26262 functional safety standard. It may also be used in […]

Hirose – Miniature circular connector features push-pull locking assembly

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Hirose has introduced the HR25A, a series of miniature push-pull, high-density circular connectors. The HR25A series consists of plugs, receptacles and jacks. The plugs come in two sizes, shell size 11 for 4, 6 or 8 contacts, and shell size 13 for 12, 16 or 20 contacts. This connector is terminated with a simple push-pull […]

ON Semiconductor – Bluetooth Low Energy system-in-package includes radio transceiver and antenna

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ON Semiconductor’s RSL10 SIP is a complete Bluetooth® Low Energy wireless system-in-package including a 2.4GHz radio transceiver, antenna and passive components. It provides the easiest way to implement low-power Bluetooth Low Energy technology in wireless communication applications. The RSL10 SIP, which has the part number NCH-RSL10-101S51-ACG, supports both Bluetooth Low Energy and proprietary 2.4GHz radio […]

OSRAM – New Bluetooth module enables sophisticated lighting control over Bluetooth link to smartphone

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OSRAM has introduced the OPTOTRONIC® OT BLE DIM, a dimmer module which uses a Bluetooth® Low Energy radio network to enable lighting control via a smartphone app. It offers a simple, intuitive and powerful method for users to control lighting without the need for additional wiring. The use of the OT BLE DIM makes the […]

Panasonic – Compact connectors with excellent shock and vibration resistance

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Panasonic has developed narrow-pitch, board-to-board and board-to-Flat Printed Circuit (FPC) connectors which use TOUGH CONTACT technology. In addition to their excellent shock and vibration resistance, these connectors feature an ultra-slim profile, which makes them ideally suited to applications in which space is restricted. Board-to-board connectors are comprised of two halves: socket and header. This connector […]

Panasonic – FPC/FFC connectors give reliable performance and long lifetime

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The Panasonic range of Flat Printed Circuit (FPC)/Flexible Flat Cable (FFC) narrow-pitch connectors benefit from TOUCH CONTACT technology to provide excellent shock and vibration resistance, giving reliable performance and a long lifetime in the end application. An FPC/FFC connector is a one-piece connector which makes the connection with a directly inserted FPC or FFC, and […]

STMicroelectronics – 1,200V MOSFET ideal for designs requiring high power density

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The STP8N120K5 from STMicroelectronics is a very high-voltage N-channel power MOSFET which uses MDmesh™ K5 technology based on an innovative proprietary vertical structure. The unique technology from which the MOSFET is built produces very low on-resistance and ultra-low gate charge for applications requiring superior power density and high efficiency. The MDmesh K5 series is particularly […]

STMicroelectronics – Certified stand-alone power controller provides for safe, seamless migration to USB Type-C

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STMicroelectronics’ STUSB4500 is a USB Power Delivery (PD) controller for sink devices that consume power supplied via a USB Type-C™ port. Offering built-in over-voltage protection of up to 22V on the Configuration Channel (CC) lines and up to 28V for the high-voltage power-supply pins, the STUSB4500 handles the higher power levels, up to 100W, supported […]

STMicroelectronics – New IGBT power modules provide superior performance for loads up to 30kW

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STMicroelectronics’ new Adaptable Compact Easier PACKage (ACEPACK™) modules provide a cost-effective and highly integrated power-conversion capability for applications with high power loads between 3kW and 30kW. ST’s space-efficient, low-profile ACEPACK technology combines high power density with reliability in an economical plastic package. Features include optional solder-free press-fit connections, which provide for a simpler assembly process […]