TE Connectivity – Metal EMI shields now available in range of standard shapes and sizes


As the complexity and functionality of electronics products increases, designers are looking for improved ways to reconcile the demand for thinner form factors with the requirement for multiple antennas, higher data rates and increased operating frequencies. This intensifies the risk that EMI will impair system performance, and creates an urgent need for high- performance EMI […]

TE Connectivity – New PCB headers provide secure wire-to-board connections


TE Connectivity (TE) has introduced an expanded line of PCB headers for its POWER TRIPLE LOCK connector system. The new single-row, right- angle and vertical headers expand the wire-to-board application options for this robust connector system, which offers a three-in-one locking feature for enhanced connection reliability. The new PCB headers are available in two-, three-, […]

TE Connectivity – Precise IR sensors for measuring blood oxygen levels


TE Connectivity (TE) supplies a range of re-usable and disposable SpO2 optical components and complete sensor packages which provide for highly accurate detection of the level of oxygen in a medical patient’s bloodstream. Drawing on more than 27 years of proven reliability and expertise, TE has designed SpO2 (blood oximetry) sensors with best in-class flexibility, […]

TE Connectivity – Socket provides tailor-made connection for latest DDR4 DRAM modules


A range of memory sockets from TE Connectivity (TE) is intended to carry JEDEC standard Small Outline Dual Inline Memory Modules (SO DIMMs) for the latest DDR4 DRAM memory devices, as well as previous DDR3, DDR2, DDR and SDRAM modules. They enable reliable interconnection to standard memory modules in computing and communication server applications. Providing […]